The thermal cycle annealing (TCA) for GaAs layer grown on Si substrate (GaA
s/Si) increased the photoluminescence (PL) intensity of InGaP epilayer whic
h was regrown on the GaAs/Si substrate by about 100 times. The full-width a
t half-maximum (FWHM) of double-crystal X-ray diffraction (DXRD) was decrea
sed from 313 to 251 arcsec. From the electron-beam-induced current (EBIC) i
mage measurements, the defect-related dark spots density (DSD) of the regro
wn InGaP layer was reduced by about 30% by using TCA GaAs/Si substrate. Thi
s means that TCA treatment for GaAs layer effectively increased the crystal
quality of InGaP epilayer regrown on GaAs/Si substrate (InGaP/GaAs/Si). Th
e PL intensity of InGaP epilayer was also enhanced due to the passivation o
f the residual defect-related nonradiative recombination centres by post-gr
owth phosphine (PH3/H-2 = 10%) plasma exposure. (C) 2001 Elsevier Science B
.V. All rights reserved.