Effect of agitation on tin-lead alloy deposition in a methane sulfonate system

Citation
Cs. Chen et al., Effect of agitation on tin-lead alloy deposition in a methane sulfonate system, PLAT SURF F, 88(1), 2001, pp. 86-89
Citations number
11
Categorie Soggetti
Metallurgy
Journal title
PLATING AND SURFACE FINISHING
ISSN journal
03603164 → ACNP
Volume
88
Issue
1
Year of publication
2001
Pages
86 - 89
Database
ISI
SICI code
0360-3164(200101)88:1<86:EOAOTA>2.0.ZU;2-E
Abstract
Tin/lead alloy electrodeposition within methane sulfonic acid (MSA) solutio ns was studied, The thickness and composition of the deposit formed under s tatic condition were investigated initially, then contrasted with the data obtained under a reflow system. It was found that when the electrolyte was stagnant, the high current area appeared on the edge region of the electrod e surface where the lead deposition dominates, while the central region of the plate was the low current area that facilitated the tin deposition. Mor eover, the increase of flow rate could significantly improve the distributi on of Pb/Sn, although it had little effect on the composition of the deposi tion, which was mainly controlled by current density. Finally, the Pb/Sn al loy deposition in a MSA bath was found to be mainly controlled by the mass transfer of active ions, So the flow pattern and circulation greatly affect the current distribution of the alloy deposition. The flow pattern with a certain cell can be accurately simulated by mathematical modeling with the assistance of appropriate flow 3D software.