Transient cooling effect by wall mass injection after backstep in high temperature flow field

Citation
Jt. Yang et al., Transient cooling effect by wall mass injection after backstep in high temperature flow field, INT J HEAT, 44(4), 2001, pp. 843-855
Citations number
10
Categorie Soggetti
Mechanical Engineering
Journal title
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
ISSN journal
00179310 → ACNP
Volume
44
Issue
4
Year of publication
2001
Pages
843 - 855
Database
ISI
SICI code
0017-9310(200102)44:4<843:TCEBWM>2.0.ZU;2-5
Abstract
A new experimental methodology was developed to study the transient mixing process of the high temperature how field behind the backstep with low temp erature fluid injected from the lower surface. Temporal data show that the Row temperature at locations between 0.2 and 0.4 reattachment lengths, Xr, at 1-mm height dropped faster than other places. Temporal temperature diffe rence across the wall plate performed quite different trends before and aft er 0.6 time the reattachment length. The temporal Nusselt number distributi on over the entire wall plate reached its peak value about 5-10 s after the wall injection initiated and gradually converged to a steady-state value. (C) 2001 Published by Elsevier Science Ltd.