Difference in subsurface damage in indented specimens with and without bonding layer

Citation
H. Helbawi et al., Difference in subsurface damage in indented specimens with and without bonding layer, INT J MECH, 43(4), 2001, pp. 1107-1121
Citations number
7
Categorie Soggetti
Mechanical Engineering
Journal title
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
ISSN journal
00207403 → ACNP
Volume
43
Issue
4
Year of publication
2001
Pages
1107 - 1121
Database
ISI
SICI code
0020-7403(200104)43:4<1107:DISDII>2.0.ZU;2-Z
Abstract
This paper aims to assess the applicability of the bonded-interface techniq ue (BIT) that has been used for examining sub-surface damage in brittle mat erials. With the aid of the finite element method, the indentation stress f ields in alumina specimens with and without a bonded-interface were analyse d. It was found that the bonded-interface greatly alters the stress distrib ution in the neighbourhood of the interface. The high-stress zone shifts aw ay from the interface, and extends to the surface. Both glue layer mechanic al properties and bond thickness play a limited role in the overall stress field of the BIT alumina. Comparisons of theoretical predictions with exper imental observations showed that, to a great extent, the BIT presents a dif ferent pattern of sub-surface damage. The study clarifies the applicability of the BIT and offers a useful guideline for practitioners. (C) 2001 Elsev ier Science Ltd. hll rights reserved.