We studied the buried growth of a GaAs layer over a tungsten stripe using o
rganometallic vapor-phase epitaxy. Triethylgallium (TEG) and trimethylgalli
um (TMG) were used as group III sources. For growth without polycrystal-lik
e deposition on tungsten surface, the required growth temperature using TMG
was lower than that using TEG. For 2-mum-thick growth over a 1-mum-wide tu
ngsten stripe, the flatness of the surface grown using TMG was better than
that using TEG. Therefore, the migration length of TMG on tungsten and GaAs
must be longer than that of TEG. For a heterojunction bipolar transistor w
ith a tungsten stripe as the collector electrode, a 70-nm-wide tungsten str
ipe was buried under a 0.77-mum-thick layer of GaAs with a flat surface usi
ng TMG. A current gain of 4 was measured although the active region was gro
wn over tungsten stripe. (C) 2000 Elsevier Science B.V. All rights reserved
.