Plasma immersion ion implantation (PIII) is an excellent technique for the
surface modification of complex-shaped components. Owing to pulsed operatio
n mode of the high voltage and large slew rate, the capacitance on the high
-voltage coaxial cable can be detrimental to the process and cannot be igno
red. In fact, a significant portion of the rise-time/fall-time of the impla
ntation voltage pulse and big initial current can be attributed to the coax
ial cable.