T. Ikehara et al., New method for an accurate determination of residual strain in polycrystalline silicon films by analysing resonant frequencies of micromachined beams, J MICROM M, 11(1), 2001, pp. 55-60
The residual strain of polycrystalline silicon (poly-Si) film is evaluated
using the strain-sensitive nature of the resonant frequency of a doubly-sup
ported beam. By introducing the length dependence curve of the resonant fre
quency, the effect of the residual strain is discussed. Both measurements a
nd finite-element calculations are performed to accurately determine the re
sidual strain in two types of phosphorus-doped poly-Si films. From the fini
te-element calculations including nonlinear buckling, the post-buckling fre
quency is more sensitive to compressive residual strain than the frequency
before buckling. By also considering these post-buckling frequencies, a mor
e accurate estimation of the residual strain can be obtained.
A test chip consisting of 97 poly-Si beams of different lengths was fabrica
ted for residual-strain evaluation. By fitting the calculations with measur
ed resonant frequencies, the residual strains of the films are determined t
o be -48 +/- 5 x 10(-6) and -400 +/- 100 x 10(-6) for two types of films. T
he difference in the residual strain is explained by the heat treatment ste
ps of phosphorus-doped poly-Si films. This method is extremely suitable for
monitoring small fluctuations in the film residual strain between differen
t process runs.