Microcontact printing (mu CP) and wet chemical etching generated two-dimens
ional (2D) patterns in thin silver films, Electroplating silver onto these
patterns increased the structural integrity of the metal layer. Separating
the metal film from the substrate resulted in free-standing, 2D structures.
Folding of these structures along predesigned "hinges" produced three-dime
nsional (3D) objects. Additional electrodeposition of nickel welded hinges
into position, strengthened the structure, and joined separate pieces. By p
rinting onto cylindrical surfaces, it was possible to generate complex shap
es efficiently and to minimize joining steps.