Interfacial chemistry of the Ba/SiOxNy/Si(100) nanostructure

Citation
Pd. Kirsch et Jg. Ekerdt, Interfacial chemistry of the Ba/SiOxNy/Si(100) nanostructure, J VAC SCI A, 19(1), 2001, pp. 207-214
Citations number
29
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
ISSN journal
07342101 → ACNP
Volume
19
Issue
1
Year of publication
2001
Pages
207 - 214
Database
ISI
SICI code
0734-2101(200101/02)19:1<207:ICOTBN>2.0.ZU;2-I
Abstract
The interfacial chemistry of a barium/silicon oxynitride (SiOxNy)/silicon n anostructure was investigated with x-ray photoelectron spectroscopy (XPS) a nd secondary ion mass spectroscopy (SIMS) to determine if SiOxN(y) can serv e as a barrier for the barium strontium titanate high-k dielectric. The str ucture consisted of 17 Angstrom of (4 ML) Ba on a 12 Angstrom SiOxNy barrie r layer on a Si(100) substrate. Both XPS and SIMS results suggest that bari um oxide (BaO) and silicon dioxide (SiO2) at the Ba/SiOxNy interface react to form similar to 10 Angstrom of multiphase barium silicate even at 300 K. The kinetics of this reaction were accelerated by annealing the structure in a stepwise fashion to 1000 K. During the annealing, the BaO and SiO2 XPS chemical states attenuate leaving two silicate states. Below the silicate layer, in the oxygen poor region of the nanostructure, similar to 10 Angstr om BaSix formed. Annealing the nanostructure to 1000 K for 5 min tested the barrier capabilities of the 12 Angstrom SiOxNy layer. SIMS Ba+, BaSi+, BaS iO+ and Si2N+ signals reveal that Ba containing species do not significantl y penetrate below the N drop Si-3 bonds characteristic of SiOxNy. Compariso n of similar to 11 Angstrom SiO2 and similar to 12 Angstrom SiOxNy confirms that the N drop Si-3 bonds are the key to the barrier properties. Without N atom incorporation, the Ba+ SIMS signal increased 66% and penetrated simi lar to 24 Angstrom deeper into the Si substrate after a 5 min 600 K anneal. (C) 2001 American Vacuum Society.