Contact angles and spreading kinetics of Al and Al-Cu alloys sintered AlN

Authors
Prin, GR Baffie, T Jeymond, M Eustathopoulos, N
Citation
Gr. Prin et al., Contact angles and spreading kinetics of Al and Al-Cu alloys sintered AlN, MAT SCI E A, 298(1-2), 2001, pp. 34-43
Citations number
28
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN journal
09215093 → ACNP
Volume
298
Issue
1-2
Year of publication
2001
Pages
34 - 43
Database
ISI
SICI code
0921-5093(20010131)298:1-2<34:CAASKO>2.0.ZU;2-F
Abstract
Wetting (both final contact angles and spreading kinetics) and bonding (W-a ) of pure Al and Al-Cu alloys on sintered AIN are studied by sessile drop e xperiments under high vacuum at 1100 degreesC. At this temperature, the pro cess which controls the spreading rate is shown to be the deoxidation of AI N surface. The mechanical behaviour of solidified droplets on cooling can b e explained satisfactorily taking into account two parameters: the work of adhesion of the alloys on AlN and the yield stress of the alloys. (C) 2001 Elsevier Science B.V. All rights reserved.