Integration of optical interconnects and optoelectronic elements on wafer-scale

Citation
P. Dannberg et al., Integration of optical interconnects and optoelectronic elements on wafer-scale, MAT SC S PR, 3(5-6), 2000, pp. 437-441
Citations number
5
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
ISSN journal
13698001 → ACNP
Volume
3
Issue
5-6
Year of publication
2000
Pages
437 - 441
Database
ISI
SICI code
1369-8001(200010/12)3:5-6<437:IOOIAO>2.0.ZU;2-7
Abstract
The UV-reaction molding technology enabling for the fabrication of microopt ical elements with rectangular, triangular or circular cross-sections (wave guides, prisms, lenses) in optical polymers is described. Multimode wavegui de optical interconnects, coupling prisms and holding structures for fibers can be fabricated in one step. A three-dimensional monomode waveguide inte rconnection module is presented. Stability tests of the microoptical elemen ts are reported. (C) 2001 Elsevier Science Ltd. All rights reserved.