Crack growth in alumina at high temperature

The trailing fracture process zone associated with stable crack growth at r oom and elevated temperature in high density polycrystalline alumina was an alyzed by a hybrid experiment al-numerical procedure. The experimental and numerical procedures involved moire interferometry and finite element analy ses, respectfully. The crack bridging stress and the dissipated energy in t he Fracture process zone were determined at room temperature, 600 degreesC. 800 degreesC and 1000 degreesC. Both quantities decreased at elevated temp erature due to grain boundary sliding. (C) 2000 Elsevier Science Ltd. All r ights reserved.