J. Jeong et al., 1.6-and 3.3-W power-amplifier modules at 24 GHz using waveguide-based power-combining structures, IEEE MICR T, 48(12), 2000, pp. 2700-2708
Citations number
13
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
Both 1.6- and 3.3-W power-amplifier (PA) modules were developed at 24 GHz u
sing a waveguide-based power combiner. The combiner is based on a double an
tipodal finline-to-microstrip transition structure, which also serves as a
two-way power combiner. The proposed 1 x 2 combining structure was analyzed
and optimized by finite-element-method (FEM) simulations and experiments,
An optimized 1 x 2 power combiner showed a very low back-to-back insertion
loss of 0.6 dB and return losses better than 17 dB over most of Ka-band, Th
e resonant behavior of the combiner was also identified and analyzed using
an FEM simulator, The two-way power-combining approach was extended to four
-way (2 x 2) power combining by vertical stacking inside the waveguide. No
degradation in the combining efficiency was observed during this process, d
emonstrating the scalability of the proposed approach, The implemented 1 x
2 power module that combines two 1-W monolithic-microwave integrated-circui
t (MMIC) PAs showed an output power of 1.6 W and a combining efficiency of
83% around 24 GHz, The 2 x 2 PA module combining the four 1-W MMICs showed
an output power of 3.3 W together with an almost identical combining effici
ency, This paper demonstrates the potential of the proposed power combiner
for high-power amplification at millimeter-wave frequencies.