Optical functions of low-k materials for interlayer dielectrics

Citation
K. Postava et T. Yamaguchi, Optical functions of low-k materials for interlayer dielectrics, J APPL PHYS, 89(4), 2001, pp. 2189-2193
Citations number
27
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF APPLIED PHYSICS
ISSN journal
00218979 → ACNP
Volume
89
Issue
4
Year of publication
2001
Pages
2189 - 2193
Database
ISI
SICI code
0021-8979(20010215)89:4<2189:OFOLMF>2.0.ZU;2-U
Abstract
The optical functions of low dielectric constant (low-k) materials have bee n determined using a high-precision four-zone null spectroscopic ellipsomet er in the spectral range from 1.5 to 5.4 eV (230-840 nm wavelength region). The ellipsometric data were fitted simultaneously with near-normal inciden ce reflectivity spectra (ranging from 0.5 to 6.5 eV). A general method of s imultaneous treatment of ellipsometric and reflectivity data is demonstrate d on representative materials used in the semiconductor industry for interl ayer dielectrics: (1) SiLK-organic dielectric resin from the Dow Chemical C ompany, (2) Nanoglass-nanoporous silica from the Honeywell Electronic Mater ials Company, and (3) tetra-ethyl-ortho-silicate (TEOS) (SiO2)-the standard dielectric material. The low-k materials (SiLK and Nanoglass) were prepare d by a standard spin-coating process, while the SiO2 layer was prepared by thermal decomposition from TEOS onto single-crystal silicon wafers. (C) 200 1 American Institute of Physics.