Laser-assisted metal deposition from liquid-phase precursors on polymers

In this work, a short review is presented for results utilizing the techniq ue of laser-assisted metallization of dielectrics. Experimental efforts and results related to the metal (palladium (Pd). copper (Cu) and silver (Ag)) deposition on polymeric materials (polyimide (PI), mylar) are reported. Th ese polymers and metals are chosen due to their growing importance in the r apidly-developing microelectronics packaging industry. The method of laser- induced chemical liquid-phase deposition (LCLD) offers many advantages comp ared to other techniques such as laser-induced forward transfer (LIFT), pul sed-laser deposition (PLD) and laser-assisted chemical vapor-phase depositi on (LCVD). The LCLD is time and cost effective because vacuum tools and spe cial pre-treatments are not required. The consumed chemicals used in precur sors are non-harmful and easy to handle due to the liquid phase. For the optimal physical and chemical properties of deposits, the laser and solution parameters are varied. XeCl and KrF excimer and Ar+ lasers are em ployed for executing the palladium. Ag and/or Cu formation on the polymer s ubstrates. Chemical and physical analyses of the formed metal patterns are performed by EDX, XRD, FESEM, SEM, resistance and adhesion measurements. (C ) 2001 Elsevier Science B.V. All rights reserved.