Study of interaction between polyimide and Cu under a high humidity condition

Polyimide (PI) films coated on Cu films were treated under a high humidity condition. FT-IR RAS measurements have clarified the interface reactions of Cu with PI, the hydrolysis of imide functional group and formation of Cu c arboxylate. From the calculation of RAS spectra measured at various inciden t angles. the diffusion of Cu carboxylate was confirmed from interface to t he surface of PI. The diffusion length of Cu carboxylate ranges about 1 mum from Cu interface. The RAS result coincides with the ATR depth profile res ult and TEM-EDX image. Transmission electron microscope (TEM) images show t hat Cu diffuses mainly into the Cu carboxylate formation under our high hum idity condition. (C) 2001 Elsevier Science B.V. All rights reserved.