The electronics industry is increasingly focused on the consumer marketplac
e, which requires low-cost high-volume products to be developed very rapidl
y. This, combined with advances in deep submicrometer technology have resul
ted in the ability and the need to put entire systems on a single chip. As
more of the system is included on a single chip, it is increasingly likely
that the chip will contain both analog and digital sections. Developing the
se mixed-signal (MS) systems-on-chip presents enormous challenges both to t
he designers of the chips and to the developers of the computer-adided desi
gn (CAD) systems that are used during the design process. This paper presen
ts many of the issues that act to complicate the development of large singl
e chip MS systems and how CAD systems are expected to develop to overcome t
hese issues.