A method of preparation of thin (1000 Angstrom) porous silicon layers
by chemical etching of c-Si in HF:HNO3:H2O = 1:3:5 solution is reporte
d wherein a thin Al film is deposited by evaporation on the silicon su
rface prior to etching. The method is characterized by no ''incubation
'' period to the onset of the stain etching. The reaction between Al a
nd HNO3 produces the required holes for the very fast start of the che
mical etching of Si. Using Al patterns deposited through a mask or pre
pared by photolithography it is possible to achieve selective formatio
n of porous silicon. The porous silicon layers exhibit visible photolu
minescence and when prepared on p-type c-Si and a shallow p-n c-Si hom
ojunction the resulting heterostructures also display electroluminesce
nce and photovoltaic properties. (C) 1997 Elsevier Science S.A.