Ym. Jin et Gj. Weng, A relaxed-constraint model for the tensile behavior of polycrystal shape-memory alloy wires, MET MAT T A, 32(2), 2001, pp. 305-313
This article provides a micromechanics-based theory to elucidate that the t
hermomechanical behavior of a polycrystal shape-memory alloy (SMA) wire is
different from that of a bulk material. The study is based on the observati
on that a polycrystal wire cannot retain any significant amount of internal
stress in the transverse direction; thus, the internal stress of its const
ituent grains is predominantly tensile and the transverse components can be
relaxed to zero. The heterogeneous tensile internal stress is then calcula
ted from a self-consistent relation. By this internal stress and an irrever
sible thermodynamic principle, the decrease of Gibbs free energy and the th
ermodynamic driving force for martensitic transformation in the grain is es
tablished. This leads to a kinetic equation for the evolution of the marten
site phase in each constituent grain and then, by an orientational average
process, the evolution of the overall phase-transformation strain of the po
lycrystal SMA wire. Applications of the theory to a Ti-Ni wire under a ther
mal cycle and under a stress cycle have led to results that are consistent
with experimental data. As compared to the bulk behavior, the range of tran
sformation temperatures for the wire is substantially narrower, and the tan
gent modulus of its stress-strain curves is much lower. These characteristi
cs point to the superiority of an SMA wire over the bulk in smart-material
applications and are both attributable to its reduced geometrical constrain
t in the transverse direction.