Via and embedded resistor formation by matrix-assisted pulsed laser deposition

A novel method of forming vias and embedded resistors in a double-sided ele ctronic circuit substrate is proposed. The structures are formed by removin g conductive material from a target by laser ablation and depositing it int o a hole previously drilled in the substrate. The target is composed of a m atrix material, which is readily ablated, supporting conductive particles t hat are ejected along with the matrix material to be re-deposited on the si des of the hole. The nature of the conductive particles determines whether a via or a resistor is formed.