The influence of tensile stresses coupled with temperature cycling has been
determined on a Cu-Zn-Al shape memory alloy that transforms above room tem
perature. It is shown that the application of increasing stresses during th
ermal cycles leads to an increasing martensite stabilization. The repeated
thermal cycling with constant stress as well as slow temperature rates incr
ease the stabilization. This phenomenon is attributed to a pinning of auste
nite-martensite interfaces by vacancies. This hypothesis is confirmed by th
e comparison of experiments with continuous and with stepwise temperature v
ariations.