Microstructure of beta-FeSi2 thin films prepared by pulsed laser deposition

Citation
T. Yoshitake et al., Microstructure of beta-FeSi2 thin films prepared by pulsed laser deposition, THIN SOL FI, 381(2), 2001, pp. 236-243
Citations number
20
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
381
Issue
2
Year of publication
2001
Pages
236 - 243
Database
ISI
SICI code
0040-6090(20010115)381:2<236:MOBTFP>2.0.ZU;2-S
Abstract
Iron disilicide thin films were prepared by pulsed laser deposition (PLD) o n Si (100) substrates using a FeSi2 alloy target. Droplet-free films could be deposited at a fluence between 2 and 4 J/cm(2) using a 193-nm laser. Pol ycrystalline films of beta -FeSi2 phase could be formed even at a substrate temperature of 20 degreesC. In addition to the beta -FcSi(2) phase, the Fe Si phase was observed for substrate temperatures between 400 and 600 degree sC. This is attributed to the mobility enhancement of Si atoms. At 700 degr eesC, the FeSi phase disappeared and beta -FeSi2 single-phase films having a columnar structure were grown due to the mobility enhancement of both the Fe and Si atoms. At the substrate temperatures of less than 600 degreesC, the lattices of beta -FeSi2 were distorted. At substrate temperatures highe r than 700 degreesC, the lattice constants approached the bulk values. The films deposited at more than 700 degreesC were grown epitaxially on Si(100) with the relation of beta -FeSi2 (041) or (014) II Si (220) at the beginni ng of deposition. As the film thickness increases, the epitaxial growth bec omes disordered and finally becomes non-oriented near the film surface. For all films deposited at various substrate temperatures, the stoichiometry w as constant in the depth direction. Thus, it is suggested that Si atoms fro m the substrate hardly diffused into the film. The generation of iron disil icide in the PLD deposition mechanism is also discussed. (C) 2001 Elsevier Science B.V. All rights reserved.