Previous studies of the formation of buried silicide layers through mesotax
y, i.e., the introduction of the metal component by ion implantation with s
ubsequent annealing of the structure, have shown that high-quality films ca
n be achieved. but at processing temperatures too high to be useful for int
egration with silicon device technology. Recently, we proposed a modified r
ipening model to describe the early stages of the formation of a buried fil
m which intentionally excluded the role of defects. In the current study, t
he predictions of that model are tested by varying sample preparation condi
tions. We show that the shift of the silicide precipitate layer is correlat
ed with the narrowing of the cobalt profile, thus requiring both processes
to be described by the same mechanism. We also show in a TEM study that spe
cific defect morphologies are correlated with specific properties of the fo
rming buried film, requiring an extension of the previous model. (C) 2001 E
lsevier Science B.V. All rights reserved.