High power, 0.81-mu m-emitting, semiconductor diode lasers are used as
pump sources for Nd:YAG solid-state lasers. Devices (1-mm-long) consi
sting of /In-0.5(Ga0.9Al0.1)(0.5)P/In-0.5(Ga0.5Al0.5)(0.5)P laser stru
cture provide a threshold-current density, J(th), of 290 A/cm(2) and a
relatively high threshold-current characteristic temperature, T-0 (14
0 K). Uncoated diode lasers (1.2-mm-long) have a maximum continuous wa
ve output power of 5 W (both facets) at 20 degrees C. The internal pow
er density at catastrophic optical mirror damage (COMD), (P) over bar(
COMD), is determined to be 9.1 MW/cm(2); that is, 1.8 times that for G
aAs-active layer, Al-free, uncoated devices. Coated, InGaAsP-active de
vices are expected to have (P) over bar(COMD)=18 MW/cm(2), more than t
wice the (P) over bar(COMD) of AlCaAs-active, 0.81-mu m-emitting devic
es with the same emitting aperture. Therefore, 0.81-mu m-emitting, InG
aAsP-active diode lasers should operate reliably at powers at least tw
ice those of AlGaAs-based devices with the same contact-stripe geometr
y. (C) 1997 American Institute of Physics.