High purity copper metal is deposited from highly volatile copper complexes
at temperatures near 250 degreesC. SEM shows a dense microstructure and re
latively small grain size (see Figure), with one of the complexes producing
copper with a measured electrical resistivity of 3.4 mu Omega cm, very clo
se to the physical resistivity value of bulk copper and copper with a purit
y of over 99 %.