The molecular dynamics method is used to simulate microcrack healing during
heating or/and under compressive stress. A center microcrack in Cu crystal
could be sealed under a compressive stress or by heating. The role of comp
ressive stress and heating in crack healing was additive. During microcrack
healing, dislocation generation and motion occurred. If there were pre-exi
sted dislocations around the microcrack, the critical temperature or compre
ssive stress necessary for microcrack healing would decrease, and the highe
r the number of dislocations, the lower the critical temperature or compres
sive stress. The critical temperature necessary for microcrack healing depe
nded upon the orientation of crack plane. For example, the critical tempera
ture of the crack along (001) plane was the lowest, i.e., 770 K. (C) 2001 E
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