Chip-scale packaging is ready for prime time

Authors
Monticelli, D
Citation
D. Monticelli, Chip-scale packaging is ready for prime time, ELECTR DES, 49(3), 2001, pp. 46-46
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
ELECTRONIC DESIGN
ISSN journal
00134872 → ACNP
Volume
49
Issue
3
Year of publication
2001
Pages
46 - 46
Database
ISI
SICI code
0013-4872(20010205)49:3<46:CPIRFP>2.0.ZU;2-1