Creep behavior of nanocrystalline nickel at 290 and 373 K

Citation
Wm. Yin et al., Creep behavior of nanocrystalline nickel at 290 and 373 K, MAT SCI E A, 301(1), 2001, pp. 18-22
Citations number
20
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN journal
09215093 → ACNP
Volume
301
Issue
1
Year of publication
2001
Pages
18 - 22
Database
ISI
SICI code
0921-5093(20010315)301:1<18:CBONNA>2.0.ZU;2-X
Abstract
The uniaxial tensile creep behavior of porosity-free nanocrystalline nickel with 30 nm grains produced by an electrodeposition processing has been inv estigated under constant and step-load conditions at room temperature and 3 73 K in a load range 500-1050 MPa. The experimental results showed that sig nificant creep deformation occurred even at room temperature at an initial applied stress of 600 MPa or higher. The creep resistance was very sensitiv e to test temperature. The grain size and microstructure of the as received and post-creep specimens have been characterized by conventional TEM techn iques. An attempt has been made to explain the deformation behavior and cre ep mechanisms based on current findings. (C) 2001 Elsevier Science B.V. All rights reserved.