Failure of Ni/Cu laminated nanostructures

Laminated nanostructures of nickel and copper were fabricated via electrode position and their microstructure, strength and fracture behavior were char acterized using x-ray diffraction, tensile testing and electron microscopy techniques, The results of this study indicated Chat the formation of porou s regions is responsible for the brittleness of electrodeposited Ni/Cu lami nated structures. Microprobe analysis revealed that within these porous reg ions copper is deposited with a low efficiency. It is suggested that local depletion of copper ions and formation of hydrogen bubbles due to hydrodyna mics effects are responsible for the low efficiency of copper deposition an d formation of pores. The brittle fracture of nickel and copper layers is d iscussed in terms of cleavage and tearing mechanisms.