Interface induced uphill diffusion of boron: An effective approach for ultrashallow junction

Citation
Hch. Wang et al., Interface induced uphill diffusion of boron: An effective approach for ultrashallow junction, IEEE ELEC D, 22(2), 2001, pp. 65-67
Citations number
10
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE ELECTRON DEVICE LETTERS
ISSN journal
07413106 → ACNP
Volume
22
Issue
2
Year of publication
2001
Pages
65 - 67
Database
ISI
SICI code
0741-3106(200102)22:2<65:IIUDOB>2.0.ZU;2-Y
Abstract
This paper investigates anomalous diffusion behavior for ultra low energy i mplants in the extension or tip of PMOS devices. Transient enhanced diffusi on (TED) is minimal at these low energies, since excess interstitials are v ery close to the surface, Instead, interface induced uphill diffusion is fo und, for the first time, to dominate during low temperature thermal cycles. The interface pile-up dynamics can be taken advantage of to produce shallo wer junctions and improve short channel effect control in PMOS devices, Att empts to minimize TED before spacer deposition by inclusion of extra RTA. a nneals are shown to be detrimental to forming boron ultra shallow junctions .