In this letter, a method to grow high quality interpolysilicon-oxynitride (
interpoly-oxynitride) film is proposed. Samples, nitridized by NH3 with add
itional N2O annealing and CVD TEOS deposited on poly-oxynitride (poly-I) wi
th RTA NaO oxidation, show excellent electrical properties in terms of very
high electric breakdown field, ion; leakage current, high charge to breakd
own, and low electron trapping rate. This novel film is a good candidate fo
r an interpoly dielectric of future high density EEPROM and flash memory de
vices.