Hole and electron trapping in ion implanted thermal oxides and SIMOX

Citation
Bj. Mrstik et al., Hole and electron trapping in ion implanted thermal oxides and SIMOX, IEEE NUCL S, 47(6), 2000, pp. 2189-2195
Citations number
19
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Nuclear Emgineering
Journal title
IEEE TRANSACTIONS ON NUCLEAR SCIENCE
ISSN journal
00189499 → ACNP
Volume
47
Issue
6
Year of publication
2000
Part
3
Pages
2189 - 2195
Database
ISI
SICI code
0018-9499(200012)47:6<2189:HAETII>2.0.ZU;2-E
Abstract
Optically assisted methods of injecting either electrons or holes into SiO2 layers were used to determine the effect of ion implantation on charge tra pping in oxides, Dry-grown thermal oxides and the buried oxides of material grown by the SIMOX (separation by implantation of oxygen) process were stu died, Al, Si, and P ions were implanted into the oxides at doses of 1 x 10( 13) to 1 x 10(16) and the oxides were annealed at 700, 900, or 1050 degrees C after implantation. High dose implantations were found to create electron traps having high capture cross sections, the density of which depends on the implant species, suggesting that electron trapping is related to chemic al aspects of the implanted ion, This was supported by measurements on an o xide implanted with a large dose of Ar, which showed no increase in electro n trapping, It was found that the shift in the flatband voltage resulting f rom hole trapping Could be reduced by high dose implantations, and that thi s effect is only weakly dependent on implant species. The hole trapping res ults are explained in terms of the effect of implantation on the oxide stru cture.