The electric field distribution in the super junction power MOSFET is analy
zed using analytical modeling and numerical simulations in this paper. The
single-event burn-out (SEB) and single-event gate rupture (SEGR) phenomena
in this device are studied in detail. It is demonstrated that the super jun
ction device is much less sensitive to SEE and SEGR compared to the standar
d power MOSFET. The physical mechanism is explained.