Effect of soldering on metal-porcelain band strength in repaired porcelain-fused-to-metal castings

Statement of problem. Chemical bending plays a major role in the adherence between metal and porcelain. The formation of an oxide layer on solder mate rial has not been described in the literature. It is unknown whether the ap plication of solder negatively affects the bond strength between porcelain and metal. Purpose. This in vitro study assessed the effect of solder on the bond stre ngth between metal and porcelain. Material and methods. Forty 20 x 6 x 0.5 mm patterns were divided into test (20) and control (20) groups. Test samples were perforated and repaired wi th solder, and 2 layers of opaque and dentin porcelain subsequently were ap plied on all samples. The samples were subjected to a 3-point flexural test on a screw-driven mechanical testing machine at a crosshead speed of 0.5 m m/min. Failure type (adhesive vs cohesive) was quantified by digitizing pho tographs of test and control samples. Three samples in each group also were examined with an SEM coupled with an x-ray energy-dispersive spectroscopy apparatus (SEM/EDS). Means and standard deviations of loads at failure, sam ple thickness, and surface area covered with porcelain were calculated, and data were analyzed with Student t test (P less than or equal to .05). Results. The mean fracture load for test samples was significantly greater than for control samples (P=.0038). Test samples also were significantly th icker (mean thickness difference 0.14 mm) (P=.0001). When the data were con trolled for thickness by using a multiple linear regression analysis, no si gnificant difference was found (P=.68). Test samples had a greater surface area covered with opaque porcelain (P=.0006) as determined by visual inspec tion. Conclusion. In this study, soldered and nonsoldered samples did not show an y significant difference in porcelain-to-metal bond strength. Visual analys is revealed a significant difference in the amount of porcelain remaining o n the fracture surface of the test and control samples; a complete quantita tive elemental analysis with SEM/EDS is in progress.