The future of equipment development and semiconductor production

Authors
Citation
D. Maydan, The future of equipment development and semiconductor production, MAT SCI E A, 302(1), 2001, pp. 1-5
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN journal
09215093 → ACNP
Volume
302
Issue
1
Year of publication
2001
Pages
1 - 5
Database
ISI
SICI code
0921-5093(20010415)302:1<1:TFOEDA>2.0.ZU;2-4
Abstract
The semiconductor industry has experienced exceptional double-digit growth over the past 25 years, fueled by strong demand in end-use markets such as computing, communications, consumer appliances, and industrial applications . Its future, however, depends on the ability of semiconductor manufacturer s and equipment suppliers alike to lower cost while pushing the technologic al limits of lithography, materials science, and further the development of new manufacturing techniques like dual damascene. This paper will describe in detail those technology challenges that semiconductor manufacturers and equipment suppliers must overcome to extend Moore's law into the next cent ury, as well as highlight areas where equipment productivity has added, and can continue to add, tremendous value to the growth of the industry. Final ly, a new paradigm called Process Module Systems will be put forth to addre ss the increasingly complex manufacturing requirements as well as economic challenges that the industry, as a whole, faces. (C) 2001 Published by Else vier Science B.V.