Transceiver MCMs fuel 3G wireless systems

CONVERGENCE of data, voice, and other services within next-generation wirel ess systems carries many challenges for RF designers. These advanced wirele ss systems must provide enhanced voice and data transfer with improved sign al integrity compared to existing systems. At the same time, the components for these systems must cost less, be available on short notice, consume le ss power, and be smaller in order to support modern designs. Fortunately, t he use of multichip-module (MCM) technology at Stanford Microdevices (Sunny vale, CA) has made it possible to meet these demanding requirements, while providing the necessary RF performance for third-generation (3G) wireless s ystems.