On the use of WLF equation to study resin curing by dielectric spectroscopy

The aim of this study is a new investigation into thermosetting resin cure by dielectric analysis. In a first part, a semi empirical model of cure con version determination, firstly tested on epoxy systems, is applied to cyana te ester resins. Parameters of the previous equation are adjusted. Secondly , the same equation is improved in a case of non-isothermal conditions. In this aim, a thermal agitation contribution on dielectric signal is studied and modelled by means of a WLF approach. Then, in the last part, we show th e possibility and the reliability of a direct WLF use to determine cure con version. C-1 and C-2 parameters of WLF approach are calculated and compared to literature data. (C) 2001 Elsevier Science Ltd. All rights reserved.