Citation
Pl. Tu et al., Growth kinetics of intermetallic compounds in chip scale package solder joint, SCR MATER, 44(2), 2001, pp. 317-323
Citations number
17
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
SCRIPTA MATERIALIA
ISSN journal
13596462
→ ACNP
Volume
44
Issue
2
Year of publication
2001
Pages
317 - 323
Database
ISI
SICI code
1359-6462(20010202)44:2<317:GKOICI>2.0.ZU;2-9