M. Putti et al., Thermal conductivity of silver alloy stabilizers for high temperature superconductor current leads, SUPERCOND S, 14(2), 2001, pp. L1-L3
In this rapid communication, we present thermal and electrical conductivity
measurements of several Ag alloy sheaths for Bi-2223 tapes suitable for cu
rrent lead applications. The main result is that sheaths based on AgAu allo
ys with a small addition of Mg and, mainly, AgMg tapes used as dispersion h
ardened sheaths for mechanical reinforcement show an unexpected low thermal
conductivity. SEM analysis of these samples emphasizes a small grain size
due to a partial oxidation of Mg, which causes a strong reduction of the ph
onon mean free path. Moreover, resistivity measurements show that the Mg at
oms dispersed in the Ag matrix provide a significant reduction of the elect
ron mean free path. Anyway, the AgAu alloy is preferable in order to preser
ve the performances of the superconducting filaments, therefore a compromis
e can be obtained by developing composite Bi-2223 tapes with the AgAu alloy
around the superconducting filaments and an outer layer containing Mg arou
nd the filament bundle.