The localized gas discharge etching of materials

It is demonstrated that a gas discharge can be localized between separate e lements on the surface of electrodes with a preset geometry. The main chara cteristics of the localized discharge have been studied and the forms of th is discharges are established. Using the localized discharge in a fluorine- containing gas medium, size-controlled etching of silicon and silicon dioxi de with a resolution of 100 mum was performed without mask application. (C) 2001 MAIK "Nauka/Interperiodica".