Heat conduction governs the ultimate writing and reading capabilities of a
thermomechanical data storage device. This work investigates transient heat
conduction in a resistively heated atomic force microscope cantilever thro
ugh measurement and simulation of cantilever thermal and electrical behavio
r. The time required to heat a single cantilever to bit-writing temperature
is near 1 mus and the thermal data reading sensitivity DeltaR/R is near 1
x 10(-4) per vertical nm. Finite-difference thermal and electrical simulati
on results compare well with electrical measurements during writing and rea
ding, indicating design tradeoffs in power requirements, data writing speed
, and data reading sensitivity. We present a design for a proposed cantilev
er that is predicted to be faster and more sensitive than the present canti
lever. (C) 2001 American Institute of Physics.