This paper focuses on the detectability of defects causing the gates of tra
nsistors in CMOS integrated circuits to float (open), i.e., on floating gat
e transistor (FGT) faults. Such faults are known to occur in practice. It i
s increasingly important to consider their detection to meet high quality r
equirements for circuits fabricated in deep submicrometer technologies. We
focus on the detectability of FGT faults by the standard voltage- and curre
nt-based production test strategies that we refer to as static voltage (SV)
, dynamic voltage (DV), and static current (SC) test strategies. We demonst
rate how the behavior of the devices caused by FGT faults depends on two cl
asses of technological and topological parameters: the predictable and unpr
edictable parameters. We show that an FGT fault can induce abnormal logic v
alues, additional delays, or increased power supply current. We introduce t
he concept of a detectability interval, i.e., the range of values an unpred
ictable parameter may assume that allows for the fault detection using a sp
ecific test strategy. We illustrate how the detectability intervals for the
SV and DV strategies complement that of the SC strategy. In addition, a ne
w test scheme that results in an increased SC detectability of FGT faults i
s developed. Finally, we demonstrate the effects of initial trapped charges
and the effects of coupling to surrounding metal on the detectability inte
rvals of each of the test strategies.