Thin aluminum oxide barrier layers have been studied by in situ x-ray photo
electron spectroscopy to determine their oxidation degree dependence on oxi
dation time and method (thermal or plasma oxidation). A 1.5 nm thick Al lay
er is found to completely oxidize by exposure to an oxygen plasma for a tim
e in the interval 30-60 s, i.e., using the conventional plasma oxidation me
thod. For times less than 30 s, however, we observed not only a metallic-Al
peak but the formed oxide was substoichiometric. The composition of the fo
rmed oxide increased towards Al2O3 as the oxidation continued. It was also
found possible to oxidize up to 1 nm of Al, at room temperature, upon depos
ition on Co previously exposed to 9.3 Pa (70 mTorr) oxygen for 10 s. Anneal
ing junctions with the idealized structure Co/Al2O3/Co at up to 275 degrees
C was found to increase their magnetoresistance (up to 35%) and resistance
(up to a decade), if the Al was deposited on an oxidized Co bottom electrod
e. (C) 2001 American Institute of Physics.