Nondestructive evaluation of ceramic substrate with embedded passive components by SAM

Delaminations of embedded passive components are often associated with reli ability problems. Understanding the delamination can help us quickly identi fy the failure caused at an early stage of failure analysis. In this work, defects in buried capacitors have been detected by use of scanning acoustic microscopy (SAM). Defects in buried capacitors caused by thermal shock hav e also been clearly observed. The results show that SAM can be a powerful a nalytical tool for the nondestructive evaluation of delaminations in buried passive components. Through transmission scan (THRU-scan) is a fast method to detect the existence of internal defects, while Tomographic Acoustic Mu ltiple Imaging scan (TAMI-scan) is shown to be capable of detecting the loc ation and size of delaminations and voids.