Predicted fundamental vibration frequency of a heavy electronic component mounted on a printed circuit board

Authors
Citation
E. Suhir, Predicted fundamental vibration frequency of a heavy electronic component mounted on a printed circuit board, J ELEC PACK, 122(1), 2000, pp. 3-5
Citations number
19
Categorie Soggetti
Mechanical Engineering
Journal title
JOURNAL OF ELECTRONIC PACKAGING
ISSN journal
10437398 → ACNP
Volume
122
Issue
1
Year of publication
2000
Pages
3 - 5
Database
ISI
SICI code
1043-7398(200003)122:1<3:PFVFOA>2.0.ZU;2-0
Abstract
External electric leads, soldered into plated through-holes (PTHs) of print ed circuit boards (PCBs), provide, in addition to electrical interconnectio n, mechanical support for heavy electronic components (such as, say, power ones) mounted on the boards. The leads can possibly break (most likely by f atigue), if the PCB support contour is subjected to excessive oscillations. Such oscillations typically occur at the lowest resonant frequency (fundam ental frequency). The ability to predict this frequency and possibly avoid resonance conditions is of obvious practical importance. Accordingly, in th is analysis, we develop a simple formula for the evaluation of the fundamen tal vibration frequency of a heavy electronic component mounted on a PCB. T he formula is obtained for the case, when the component has only one row of leads, and the vibrations occur in the direction of the least flexural rig idity of this row. [S1043-7398(00)00601-0].