Citation
Jh. Lau et Swr. Lee, Temperature-dependent popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method, J ELEC PACK, 122(1), 2000, pp. 34-41
Citations number
11
Categorie Soggetti
Mechanical Engineering
Journal title
JOURNAL OF ELECTRONIC PACKAGING
ISSN journal
10437398
→ ACNP
Volume
122
Issue
1
Year of publication
2000
Pages
34 - 41
Database
ISI
SICI code
1043-7398(200003)122:1<34:TPAOPB>2.0.ZU;2-2
Abstract
The popcorning effect of plastic ball grid array (PBGA) packages is analyze
d using the method of fracture mechanics. The following three specific prob
lems are studied: (1) crack initiation in the die attach of the package, (2
) crack growth in the die attach, and (3) crack growth at the interface bet
ween the solder mask and copper. Two different methods (crack tip opening d
isplacement and virtual crack closure technique) are used to determine the
crack-tip parameters such as the strain energy release rate, stress intensi
ty factors, and phase angle for different crack lengths and temperatures. [
S1043-7389(00)00401-1].