Influence of gas composition on wafer temperature in a tungsten chemical vapor deposition reactor: Experimental measurements, model development, and parameter identification

Citation
Hy. Chang et al., Influence of gas composition on wafer temperature in a tungsten chemical vapor deposition reactor: Experimental measurements, model development, and parameter identification, J VAC SCI B, 19(1), 2001, pp. 230-238
Citations number
31
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
ISSN journal
10711023 → ACNP
Volume
19
Issue
1
Year of publication
2001
Pages
230 - 238
Database
ISI
SICI code
1071-1023(200101/02)19:1<230:IOGCOW>2.0.ZU;2-R
Abstract
Experimental measurements of wafer temperature in a single-wafer, lamp-heat ed chemical vapor deposition system were used to study the wafer temperatur e response to gas composition. A physically based simulation procedure for the process gas and wafer temperature was developed in which a subset of pa rameter values were estimated using a nonlinear, iterative parameter identi fication method, producing a validated model with true predictive capabilit ies. With process heating ramp power held constant, wafer temperature varia tions of up to 160 K were observed by varying the feed gas H-2/N-2 ratio. H eat transfer between the wafer and susceptor was studied by shifting the in strumented wafer off the susceptor axis, exposing a portion of the wafer ba ckside to the chamber floor. Model predictions and experimental observation s both demonstrated that the gas velocity field had little influence on the observed wafer and predicted gas temperatures. (C) 2001 American Vacuum So ciety.