Influence of gas composition on wafer temperature in a tungsten chemical vapor deposition reactor: Experimental measurements, model development, and parameter identification
Hy. Chang et al., Influence of gas composition on wafer temperature in a tungsten chemical vapor deposition reactor: Experimental measurements, model development, and parameter identification, J VAC SCI B, 19(1), 2001, pp. 230-238
Experimental measurements of wafer temperature in a single-wafer, lamp-heat
ed chemical vapor deposition system were used to study the wafer temperatur
e response to gas composition. A physically based simulation procedure for
the process gas and wafer temperature was developed in which a subset of pa
rameter values were estimated using a nonlinear, iterative parameter identi
fication method, producing a validated model with true predictive capabilit
ies. With process heating ramp power held constant, wafer temperature varia
tions of up to 160 K were observed by varying the feed gas H-2/N-2 ratio. H
eat transfer between the wafer and susceptor was studied by shifting the in
strumented wafer off the susceptor axis, exposing a portion of the wafer ba
ckside to the chamber floor. Model predictions and experimental observation
s both demonstrated that the gas velocity field had little influence on the
observed wafer and predicted gas temperatures. (C) 2001 American Vacuum So
ciety.