S. Yasin et al., Nanolithography using ultrasonically assisted development of calixarene negative electron beam resist, J VAC SCI B, 19(1), 2001, pp. 311-313
Negative resist image distortion is caused by resist swelling during develo
pment and is a major problem in ultrahigh resolution electron beam lithogra
phy. This problem has been overcome through the use of ultrasonically assis
ted development. In addition, exposure dose latitude is increased by 50% co
mpared to conventional dip development, due to the improvement in contrast.
These advantages have been exploited in order to realize similar to6 nm wi
de lines in calixarene resist. (C) 2001 American Vacuum Society.