Development of self-adhesion above the melting temperature was studied in a
group of linear low-density polyethylenes. An experimental procedure for c
onsecutively sealing and peeling a polymeric film at the same temperature,
above the melting point, was developed. This made it possible to measure me
lt adhesion over a nide range of temperatures, seal times, and peel rates.
Taking advantage of the new experimental technique, the molecular mechanism
s and kinetics of self-adhesion in heterogeneous ethylene copolymers with b
road molecular weight distribution were investigated. It was found that the
peel strength increased with the contact time in accordance with the conve
ntional t(1/2) dependence until saturation at the maximum strength. The tim
e to achieve maximum strength was significantly shorter for the copolymer w
ith more homogeneous copolymer composition; however, the maximum strength w
as the same for all the materials at each test temperature. The saturation
time in all cases was 2 orders of magnitude longer than the time for comple
te interdigitation of the surface chains. This was ascribed to the presence
of a surface layer of about 100 nm that needed to resolve after sealing th
e surfaces before the maximum adhesive strength could develop. The layer wa
s thought to originate from surface segregation of the lower molecular weig
ht, higher branch content fraction of the material.