Micromachining of diamond probes for atomic force microscopy applications

Citation
K. Unno et al., Micromachining of diamond probes for atomic force microscopy applications, SENS ACTU-A, 88(3), 2001, pp. 247-255
Citations number
30
Categorie Soggetti
Instrumentation & Measurement
Journal title
SENSORS AND ACTUATORS A-PHYSICAL
ISSN journal
09244247 → ACNP
Volume
88
Issue
3
Year of publication
2001
Pages
247 - 255
Database
ISI
SICI code
0924-4247(20010305)88:3<247:MODPFA>2.0.ZU;2-C
Abstract
We realized IC-compatible diamond atomic force microscope (AFM) probe techn ology using our newly developed anodic bonding technique of diamond film to glass together with microfabrication techniques employing CVD diamond film . Using Al film as an intermediate layer, diamond film can be anodically bo nded to Pyrex 7740 glass at a bonding temperature of 500 degreesC, with an electric voltage of 600 V, and a bonding time of 3 h in atmosphere. Moreove r, by depositing Ti film as an adhesive layer between the diamond film and the Al him, a bond strength of 1-2 MPa was obtained. Based on the batch fab rication process proposed here, we demonstrate diamond AFM probes for conta ct mode measurements consisting of two kinds of V-shaped cantilever integra ted with a pyramidal tip. The cantilevers were optimally designed by a fini te element analysis, giving spring constants of approximately 1 and 5 N/m. The diamond cantilevers and diamond tips were fabricated on a Si substrate by a selective deposition of diamond film and a Si mold technique, respecti vely. Through anodic bonding of a glass backing plate to a diamond base fol lowed by removing the unnecessary Si substrate, diamond probes were success fully obtained. The fabrication process described here would allow the prod uction of large quantities of diamond AFM probes, resulting in a high cost performance. (C) 2001 Elsevier Science B.V. All rights reserved.